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A material with high bonding energy has low thermal expansion coefficient.()

提问人:网友Chenshan2019 发布时间:2022-06-02
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第1题
What are the characters of stiff materials?

A、High Elastic Modulus

B、Low Young’s Modulus

C、High Bonding Energy within the Material

D、Low Yield Strength

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第2题
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第3题
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第5题
Which type of chemical bonding enable aramid fiber with high strength?()

A.A.covalent bonding

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第6题
Which of the following statements are correct?

A、The greater the modulus, the stiffer the material.

B、The stiffer the material, the higher the resistance of the material to deformation.

C、The higher the magnitude of elastic modulus, the higher the magnitude of the inter-atomic bonding forces in a material.

D、The higher the magnitude of elastic modulus, the lower the magnitude of the intermolecular bonding forces in a material.

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第7题
Which of the following statements are correct_____.
A、The greater the modulus, the stiffer the material.

B、The stiffer the material, the higher the resistance of the material to deformation.

C、The higher the magnitude of elastic modulus, the higher the magnitude of the inter-atomic bonding forces in a material.

D、The higher the magnitude of elastic modulus, the lower the magnitude of the intermolecular bonding forces in a material.

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第8题
Generally speaking in an organic material, the average energy of a hole is approximately equal to the energy of HOMO electron
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第9题
Crystals which are mainly formed by metallic bonding

A、hardness is either high or low

B、solid conductive

C、liquid conductive

D、high melting point

E、poor plasticity

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