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Chip集成电路

提问人:网友tlds119 发布时间:2022-01-06
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更多“Chip集成电路”相关的问题
第1题
集成电路产业链有()。

A.芯片(chip)设计

B.晶圆(wafer)和芯片制造

C.晶圆和芯片设备制造

D.芯片封装(package)、测试(test)

E.芯片材料生产

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第2题
表面贴装集成电路的封装主要有小外形封装(SOP: Small Outline Package)、塑封有引线芯片封装(PLCC
: Plastic Leaded Chip Carrier)、方形扁平封装(QFP: Quad Flat Package)、无引线陶瓷芯片封装(LCCC: Leadless Ceramic Chip Carrier)、 、载带自动键合(TAB:tape automated bonding)、微凸点连接(MBB: Micro-Bump Bonding)等。

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第3题
表面贴装集成电路的封装主要有 、塑封有引线芯片封装(PLCC: Plastic Leaded Chip Carrier)、方形扁
平封装(QFP: Quad Flat Package)、无引线陶瓷芯片封装(LCCC: Leadless Ceramic Chip Carrier)、球栅阵列封装(BGA:Ball Grid Array)封装、载带自动键合(TAB:tape automated bonding)、微凸点连接(MBB: Micro-Bump Bonding)等。

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第4题
表面贴装集成电路的封装主要有小外形封装(SOP: Small Outline Package)、塑封有引线芯片封装(PLCC
: Plastic Leaded Chip Carrier)、 、无引线陶瓷芯片封装(LCCC: Leadless Ceramic Chip Carrier)、球栅阵列封装(BGA:Ball Grid Array)封装、载带自动键合(TAB:tape automated bonding)、微凸点连接(MBB: Micro-Bump Bonding)等,

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第5题
表面贴装集成电路的封装主要有小外形封装(SOP: Small Outline Package)、 、方形扁平封装(QFP: Qua
d Flat Package)、无引线陶瓷芯片封装(LCCC: Leadless Ceramic Chip Carrier)、球栅阵列封装(BGA:Ball Grid Array)封装、载带自动键合(TAB:tape automated bonding)、微凸点连接(MBB: Micro-Bump Bonding)等。

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第6题
下列关于EMV叙述错误的是().
A、EMV是为了防范伪卡欺诈风险,实施全球范围内各组织所发行IC卡与终端的互操作性制定的IC卡全球操作框架。

B、EMV是Europay、Mastercard、Visa三大银行卡公司的缩写。

C、EMV规范于1994年开始制定,并于1996年第一次发布。简称EMV96。2000年又发布了EMV2000。

D、Visa、万事达卡和JCB都参考《EMV2000支付系统集成电路卡规范》,制订了各自相应的规范:《Visa集成电路卡规范》(简称VIS)、《万事达卡借记/贷记芯片最小需求》(简称M/chip)、《JCBIC卡规范》(简称JSmart)

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第7题
A new era is upon us. Call it what you will: the service economy, the information age, the
knowledge society. It is all translated to a fundamental change in the way we work. Already we've partly been there. The percentage of people who earn their living by making things has fallen dramatically in the Western World. Today the majority of jobs in America, Europe and Japan (two thirds or more in many or these countries) are in the service industry, and the number is on the rise. More women are in the work force than ever before. There are more part-time jobs. More people are self-employed. But the breadth of the economic transformation can't be measured by numbers alone, because it is also giving rise to a radical new way of thinking about the nature of work itself. Long-held notions about jobs and careers, the skills needed to succeed, even the relation between individuals and employers—all these are being changed.

We have only to look behind us to get some sense of what may lie ahead. No one looking ahead 20 years possibly could have foreseen the ways in which a single invention, the chip (集成电路), would transform. our world thanks to its applications in personal computers, digital communications and factory robots. Tomorrow's achievements in biotechnology, artificial intelligence or even some still unimagined technology could produce a similar wave of dramatic changes. But one thing is certain: information and knowledge will become even more vital, and the people who possess it, whether .they work in manufacturing or services, will have the advantage and produce the wealth. Computer knowledge will become as basic a requirement as the ability to read and write The ability to solve problems by applying information instead of performing routine tasks will be above all else. If you cast your mind ahead 10 years, information services will be predominant It will be the way you do your job.

A characteristic of the information age is that ______.

A.the service industry is relying more and more on the female work force

B.manufacturing industries are steadily increasing

C.people find it harder to earn a living by working in factories

D.most of the job opportunities can now be found in service industry

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第8题
名词解释:CHIP封装

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第9题
Cutting temperature is generally referred to chip temperature
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第10题
基因芯片(gene chip)

基因芯片(gene chip)

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